Small-sized quartz plates are a key basic material widely used in the electronics, optics, and semiconductor industries. The term “small size plates” is typically used to describe quartz plates with side lengths or diameters ranging from a few millimeters to dozens of millimeters.  Their thickness can be as low as the sub-millimetre level, according to application requirements.

The production process for small-sized quartz plates typically involves screening, cutting, grinding, polishing, cleaning, inspection and other steps. The raw materials are primarily high-purity quartz sand or natural crystals, which are purified and melted into quartz ingots. During the cutting process, an internal cylindrical cutting machine or multi-wire cutting equipment is used to cut the ingots into thin slices with controlled thickness tolerance. Due to the high requirements for the edge flatness and surface roughness of small quartz plates, the subsequent grinding and polishing processes require precise adjustment of the abrasive particle size and processing time.

From an industry classification perspective, the production of small-sized quartz plates typically involves multiple simultaneous processing capabilities, as well as the production of quartz slotted and frosted plates, and large-sized quartz plates. Large and small sized quartz plates differ significantly in terms of processing equipment, process parameters, and market applications. The production of small-sized products places greater emphasis on batch consistency and control of minute tolerances, thus placing higher demands on the precision of the equipment and the operational experience of manufacturers.

 The mechanical and optical properties of quartz plates are important indicators of their quality. Small quartz plates typically require good light transmittance, particularly in the ultraviolet and infrared spectrum, as well as a low coefficient of thermal expansion and stable chemical inertness. These characteristics enable quartz plates to remain stable even in high-temperature, high-pressure, or highly corrosive environments. High-purity quartz plates, for instance, are mainly used in semiconductor lithography masks, while ordinary-grade quartz plates are mostly used in optical lenses or instrument windows.

With regard to quality control, the inspection methods used include dimensional measurement (using projectors or laser micrometers), surface roughness testing (via stylus profilometer), flatness inspection (via interferometer), and light transmittance testing (via spectrophotometer). In the case of small-sized quartz plates, edge chipping and cracks are prevalent defects. Such non-conforming products must be identified through the implementation of either automated visual screening or manual spot checks.

When procuring small-sized quartz plates, it is imperative to be cognizant of their intended application. For instance, quartz plates used for optical windows must be double-sided polished and free of scratches, while the plates used for quartz crystal oscillator bases need to have their warpage and parallelism strictly controlled. The manufacturing of small-sized quartz plates necessitates highly advanced processing technologies that intersect multiple disciplines. Comprehension of the fundamental process flow and quality assessment indicators is instrumental in enabling users to make more informed decisions regarding the selection of products that align with their specific requirements.